IN
JAP BUILDCON PRIVATE LIMITED
LEI code
984500DBA0DD054VZA65
ISSUED
Legal entity details
- Registration number
- U45400DL2014PTC272794
- Legal form
- YSP9
- Entity status
- Active
- Legal jurisdiction
- IN
- Entity created
- 30/10/2014
- Legal address
- A2A/263, GROUND FLOOR JANAK PURI, New Delhi, 110058, IN
- Headquarters address
- A2A/263, GROUND FLOOR JANAK PURI, New Delhi, 110058, IN
LEI registration details
- LEI code
-
984500DBA0DD054VZA65 - Registration status
- ISSUED
- Registration authority
- RA000394
- Validation sources
- Fully corroborated
- Validation authority
- RA000394
- Initial registration
- 24/01/2022
- Last updated
- 25/02/2026
- Next renewal date
- 10/04/2027
- Managing LOU
- 529900F6BNUR3RJ2WH29