CN
江苏华昇半导体材料有限公司
LEI code
6556006HEQRWTGXPCT13
LAPSED
Legal entity details
- Registration number
- 91320301MA1WJRJP0D
- Legal form
- ECAK
- Entity status
- Active
- Legal jurisdiction
- CN
- Legal address
- 鼓楼区经济技术开发区杨山路66号, 徐州市, CN-JS, 221000, CN
- Headquarters address
- 鼓楼区经济技术开发区杨山路66号, 徐州市, CN-JS, 221000, CN
LEI registration details
- LEI code
-
6556006HEQRWTGXPCT13 - Registration status
- LAPSED
- Registration authority
- RA000092
- Validation sources
- Fully corroborated
- Validation authority
- RA000092
- Initial registration
- 04/01/2021
- Last updated
- 01/03/2022
- Next renewal date
- 04/01/2022
- Managing LOU
- 655600IJ8LS3CCDA4421