US
OSM Loan Acquisitions II LP
LEI code
549300KBG07M5ICHGE64
LAPSED
Legal entity details
- Registration number
- 200809400030
- Legal form
- 5HQ4
- Entity status
- Active
- Legal jurisdiction
- US-CA
- Entity created
- 01/04/2008
- Legal address
- C/O Michael Orwitz, 11859 Wilshire Boulevard, Suite 505, Los Angeles, US-CA, 90025, US
- Headquarters address
- 1516 South Bundy Drive, Suite 300, Los Angeles, US-CA, 90025, US
LEI registration details
- LEI code
-
549300KBG07M5ICHGE64 - Registration status
- LAPSED
- Registration authority
- RA000598
- Validation sources
- Fully corroborated
- Validation authority
- RA000598
- Initial registration
- 10/10/2013
- Last updated
- 10/06/2025
- Next renewal date
- 07/10/2014
- Managing LOU
- 5493001KJTIIGC8Y1R12