CN
烨辉(中国)科技材料有限公司
LEI code
300300ZPXM2ZVBY51271
LAPSED
Legal entity details
- Registration number
- 91320000732252887P
- Legal form
- ECAK
- Entity status
- Active
- Legal jurisdiction
- CN
- Entity created
- 27/01/2002
- Legal address
- 常熟市经济开发区沿江工业区烨辉路1号, 苏州市, CN-JS, 100000, CN
- Headquarters address
- 常熟市经济开发区沿江工业区烨辉路1号, 苏州市, CN-JS, 100000, CN
LEI registration details
- LEI code
-
300300ZPXM2ZVBY51271 - Registration status
- LAPSED
- Registration authority
- RA000092
- Validation sources
- Fully corroborated
- Validation authority
- RA000092
- Initial registration
- 29/03/2020
- Last updated
- 21/02/2023
- Next renewal date
- 21/02/2024
- Managing LOU
- 655600IJ8LS3CCDA4421