CN
苏州市融风科技小额贷款有限公司
LEI code
300300Z1816632000069
LAPSED
Legal entity details
- Registration number
- 91320000MA1M95KB9C
- Legal form
- ECAK
- Entity status
- Active
- Legal jurisdiction
- CN
- Entity created
- 27/09/2015
- Legal address
- 苏州市工业园区月亮湾路10号慧湖大厦A座903, 苏州市, CN-JS, 100000, CN
- Headquarters address
- 苏州市工业园区月亮湾路10号慧湖大厦A座903, 苏州市, CN-JS, 100000, CN
LEI registration details
- LEI code
-
300300Z1816632000069 - Registration status
- LAPSED
- Registration authority
- RA000092
- Validation sources
- Fully corroborated
- Validation authority
- RA000092
- Initial registration
- 13/11/2019
- Last updated
- 21/02/2023
- Next renewal date
- 21/02/2024
- Managing LOU
- 655600IJ8LS3CCDA4421