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CN

重庆市江北区金圆小额贷款股份有限公司

LEI code 300300Z1640450000006 LAPSED
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Legal entity details

Registration number
91500105574847366J
Legal form
ECAK
Entity status
Active
Legal jurisdiction
CN
Entity created
23/05/2011
Legal address
重庆市江北区建新北路38号3幢43-5, 江北区, CN-CQ, 100000, CN
Headquarters address
重庆市江北区建新北路38号3幢43-5, 江北区, CN-CQ, 100000, CN

LEI registration details

LEI code
300300Z1640450000006
Registration status
LAPSED
Registration authority
RA000092
Validation sources
Fully corroborated
Validation authority
RA000092
Initial registration
06/11/2019
Last updated
21/02/2023
Next renewal date
21/02/2024
Managing LOU
655600IJ8LS3CCDA4421
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